Enabling Reliable Performance in Advanced Electronics
Advanced ceramic substrates and electronic materials for semiconductor and power electronics applications across Southeast Asia.
Supporting HTCC, DPC, DBC, AMB, LTCC and advanced ceramic packaging solutions, with dedicated technical coordination and supply chain support.
HTCC Packaging Shell
HTCC (High Temperature Co-fired Ceramic) utilizes high-temperature co-firing of alumina or aluminum nitride with tungsten or molybdenum-based metallization to form multilayer, internally interconnected ceramic substrates.
It provides excellent mechanical strength, thermal stability, and long-term reliability for demanding applications.
Applications: IC packaging, optical communication, RF/microwave, power devices, and LEDs.
DPC Ceramic Substrate
DPC (Direct Plated Copper) substrates are fabricated using semiconductor thin-film processes to create fine copper circuit patterns on ceramic surfaces.
This process enables high-precision patterning, excellent thermal performance, and strong adhesion between copper and ceramic.
Applications: Optoelectronics, laser devices, RF modules, high-power LEDs, and advanced semiconductor packaging.
Technical Capabilities
Integrated capabilities in design, processing, and material technology for advanced ceramic packaging solutions.
Ceramic Shell / Substrate Design
Advanced structural, signal, and thermal design for customized ceramic packaging solutions, with full support from design to reliability validation.
Ceramic Processing Technology
Full-process manufacturing for LTCC, HTCC, DPC, DBC, and AMB substrates, delivering high reliability and compact ceramic packaging solutions
Advanced raw material and metal paste formulation for high-performance, cost-efficient multilayer ceramic solutions..